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Wafer Processing Engineer - Part-time Internship

Micross Components

Research Triangle, north carolina


Job Details

Other


Full Job Description

Micross Advanced Interconnect Technology is seeking a knowledgeable, self-motivated physical science or engineering student for an internship with our Process Engineering team. The internship will require extensive hands-on wafer processing in our cleanroom facilities with the successful candidate performing any of the following: wet processing, thin film depositions (sputter, e-beam, and/or PECVD), dry etching, and electroplating. The successful candidate should have some knowledge of wafer processes and basic device processing steps. Experience with material characterization, metrology measurements, data recording, and data presentation/summation is a plus.

This is a spring internship that can be extended into the summer.

25 hours a week maximum.


Other Duties & Responsibilities:

  • Comply with all safety policies, practices and procedures.
  • Comply with all quality and ITAR policies, practices and procedures;
  • Participate in proactive team efforts to achieve departmental and company goals;
  • Contribute to building a positive team spirit;
  • Communicate effectively with all levels of employees;
  • Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties.
  • Perform other related duties as assigned

Requirements

  • Rising senior in a B.S physical science or engineering program or B.S. working toward an advanced degree.
  • Excellent hands-on laboratory skills
  • Excellent written and verbal communication skills
  • PC proficiency is a must
  • Working knowledge of Word, EXCEL, and PowerPoint
  • Cleanroom experience is a plus
  • Wafer processing experience is a plus


Due to Micross AIT’s business and ITAR-registration status, successful candidates must be US citizens or US permanent resident.

Benefits

If you are interested in gaining valuable semiconductor processing experience, working in a dynamic, back-end-of-line wafer processing facility focused on advanced packaging and interconnect technologies, please apply.

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