Package Design and Layout Engineer (Boston and Mountain View)

Package Design Engineer

Lightmatter builds chips that enable extreme-scale artificial intelligence computing clusters. If you're a collaborative engineer or scientist who has a passion for innovation, solving challenging technical problems and doing impactful work like building the world's first optical computers, consider joining the team at Lightmatter!

As a Package Design Engineer at Lightmatter, you will be designing complex substrates and interposers. Lightmatter will always be on the leading edge of the technology, expanding beyond the traditional laminate materials, moving toward materials like silicon, glass, and ceramics. At Lightmatter, we hire the best of the best and allow you the autonomy to plan and execute your designs to meet the timelines and objectives using your past experience in the industry to successfully deliver these complex package layouts. These products will be used in one of the highest growing segments in the semiconductor industry and will let Lightmatter maintain its leading position in the silicon photonics technology.

Responsibilities

• Deliver IC package substrate layouts for various advanced packaging technologies.
• Actively participate in the product concept phase to deliver preliminary substrate design and floorplanning to help drive overall stack up (Silicon/package/MB) optimization. 
• Work with package substrate suppliers along with Outsourced Semiconductor Assembly and Test (OSAT) companies to understand layout design rules, stack up, and implementation.
• Create fab files, work with substrate suppliers, and OSATs to close design for manufacturing (DFM) / design for assembly (DFA).
• Design complex package layout keeping in mind signal integrity, power integrity, thermal and mechanical requirements.
• Demonstrated ability in designing packages with analog and digital elements/interfaces.
• Support signal/power integrity engineers by providing iterative test routes to refine design rules and routing topologies.
• Project Management skills to coordinate and collaborate across multiple functional teams to ensure error free Package design Tape Out in a timely manner. 
• Drive design automation & verification activities. 

Requirements

• Bachelor's degree in Electrical Engineering or similar discipline with at least 8 years of relevant experience.

• Minimum 7 years of experience in designing IC package substrate layouts.
• Experience with Cadence APD+ as the primary layout tool.
• Good understanding of the IC package substrate and organic materials, and how they will impact package design. 

Preferred Qualifications

• Educational background on IC packaging and substrate layout design. 
• Familiarity with Cadence Integrity 3DIC for package/IC codesign.
• Familiarity with layout tools e.g. Expedition Package Designer, Pads Layout, Altium, etc.
• Experience with various layout tool scripting languages, e.g. SKILL or Python to enable design automation.
• Demonstrated excellent communication skills and ability to collaborate effectively in cross-functional teams.
• Proven history of meeting time commitments and deliverables. 

Benefits

• Comprehensive Health Care Plan (Medical, Dental & Vision)
• 401k matching
• Life Insurance (Basic, Voluntary & AD&D)
• Generous Time Off (Vacation, Sick & Public Holidays)
• Paid Family Leave
• Short Term & Long Term Disability
• Training & Development
• Flexible, hybrid workplace model
• Stock Option Plan

We offer competitive compensation. The base salary range for this role, inclusive of all US locations will be from $175,000 to $210,000 determined based on location, experience, educational background, and market data.

Lightmatter recruits, employs, trains, compensates and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law.