Lead Package Assembly Integrator (Boston and Mountain View)

Lead Package Assembly Integrator

Lightmatter builds chips that enable extreme-scale artificial intelligence computing clusters. If you're a collaborative engineer or scientist who has a passion for innovation, solving challenging technical problems and doing impactful work like building the world's first optical computers, consider joining the team at Lightmatter!

In this role, you will work on leading-edge packaging technologies to enable AI architectures that set new industry standards for compute power, performance, and efficiency. As part of the Packaging Technology team, you will serve as the lead package assembly integrator. Your responsibilities will include developing assembly process technologies and generating assembly/test design rules for Heterogeneous Integrated co-packaged optics technologies by collaborating with design teams, silicon and photonics foundries, and OSAT partners. You will be responsible for developing test chip strategies, managing test chip design, and appropriately planning and managing design of experiments with partners. Additionally, you will work closely with package and system architects to incorporate manufacturability considerations into product definitions. The results of your work will lead to advanced package designs that meet assembly and reliability requirements, while delivering leading-edge products for data centers and the high-end compute segment.

Responsibilities

• Develop end-to-end 3D package assembly, test, and fiber-attach processes for Lightmatter products, ensuring robust high yields while meeting performance and reliability goals by working closely with foundry and OSAT partners.
• Define test chip requirements and manage test chip design required for 3D package process development.
• Develop and validate design rules for a high-yielding assembly process. The scope includes assembly/test, backend/RDL, silicon/package interaction, substrate, thermal/mechanical solutions, fiber attach, system integration, and other related areas.
• Plan and execute design of experiments, manage data, and perform appropriate analysis to gain insights into assembly process and design interactions.
• Perform analysis to identify key reliability risks under product use conditions and drive appropriate design and materials solutions to improve product mechanical integrity.
• Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required.
• Write reports and document methodologies.

Requirements

• M.S. or Ph.D. in Mechanical Engineering, Material Science, or related engineering field.
• Minimum 10 years of experience in wafer scale packaging assembly process development.
• Knowledge of Chip on wafer process flow, materials, and equipment requirements.
• Experience in test chip and assembly test vehicle design.
• Understanding of photonics packaging requirements including fiber attach.
• Knowledge of 2D/3D packaging technologies and exposure to thermo-mechanical challenges associated with these technologies.

Preferred Qualifications

• Demonstrated excellent communication skills and ability to collaborate effectively in cross-functional teams. 
• Knowledge of thermal/mechanical modeling and coding for data analysis.
• Ability to work independently and tackle projects with minimal supervision.
• Strong creative thinking skills with the ability to solve problems quickly.

Benefits

• Comprehensive Health Care Plan (Medical, Dental & Vision)
• 401k matching
• Life Insurance (Basic, Voluntary & AD&D)
• Generous Time Off (Vacation, Sick & Public Holidays)
• Paid Family Leave
• Short Term & Long Term Disability
• Training & Development
• Flexible, hybrid workplace model
• Stock Option Plan

We offer competitive compensation. The base salary range for this role, inclusive of all US locations will be from $205,000 to $258,000 determined based on location, experience, educational background, and market data.

Lightmatter recruits, employs, trains, compensates and promotes regardless of race, religion, color, national origin, sex, disability, age, veteran status, and other protected status as required by applicable law.