Wafer Processing Engineer - IRSP (2nd Shift)

Summary:

The position will primarily focus on learning and supporting wafer processing steps required to further develop and build IR emitter pixels for the IRSP program area. This includes sputter depositions, reactive sputter depositions, ion milling, RIE, descums, ultrasonic (US) resist strips, microscope inspections, and thin film metrology. The successful candidate will need to develop an understanding of relevant process integration dependencies (e,g. interaction of patterned resist with etch processes). As time permits, a secondary goal is to become familiar with the process flows required to fabricate advanced interconnects on passive and/or active device wafers (e.g. through-Si Vias (TSV), flip-chip bumps, Cu pillars, redistribution layers, and high density microbumps). This position will support both externally and internally funded projects.

Requirements

Essential Duties &...