Senior Optical/Laser Engineer

The slicing of semiconductor material into wafers is a critical step in the semiconductor production process, yet standard slicing methods waste billions of dollars annually. Halo Industries has invented a laser-based semiconductor slicing process that eliminates this waste, delivering improvements in both material cost and performance and enabling manufacturing advancements in a diverse set of high-growth applications markets, including the automotive, grid infrastructure, telecommunications and power electronics sectors.  

Having proven the market’s appetite for its technology, Halo is now ramping production at its first pilot manufacturing facility in Santa Clara, CA to meet sales demand.  The company is expanding its engineering team to meet its current goals of automation, equipment reliability and cost optimization, as well as to drive the next set of breakthrough improvements.

The Opportunity

Halo Industries is...