Process Engineering Technician

Summary:

We are seeking a knowledgeable, self-motivated individual for our growing operations team which will support processing in a dynamic production and R&D environment. This position will focus on supporting advanced packaging processing and process development, for, but not limited to, silicon interposer fabrication, through silicon via (TSV) fabrication, wafer bumping and micro-bumping, package assembly, and integrating a combination of interconnect technologies together. The process technologies include thin film material deposition of metals, spin-on polymers, dry and wet etch processing, and photolithography processing. The ideal candidate will have a broad background in wafer processing in a cleanroom environment, and be willing and eager to learn and support new and existing process techniques. The ability to multitask and work in a team environment is required.

The applicant should also be willing to work second shift hours...